What are the applications of microchannel flat tubes in the electronic device industry
Source：
rofn.cn Release date： 2025-07-28
Information summary：Microchannel flat tube is a flat metal pipe (mostly made of aluminum, copper or alloy materials) with multiple small channels (usually with channel sizes ranging from 0.1-1mm) inside. With high heat exchange efficiency, compact structure, lightweight and other characteristics, it is widely used in the electronic device industry for heat dissipation systems. The specific application scenarios are a
Microchannel flat tube is a flat metal pipe (mostly made of aluminum, copper or alloy materials) with multiple small channels (usually with channel sizes ranging from 0.1-1mm) inside. With high heat exchange efficiency, compact structure, lightweight and other characteristics, it is widely used in the electronic device industry for heat dissipation systems. The specific application scenarios are as follows:
1、 Consumer electronic device heat dissipation
1. Laptops and tablets
The CPU and GPU of laptops generate a large amount of heat when running under high loads (such as gaming and video rendering), and traditional heat dissipation modules (such as copper pipes and fans) are gradually facing heat dissipation bottlenecks under the demand for slimness. Microchannel flat tubes can increase the heat dissipation area through dense micro channels inside, and with the help of water cooling or heat sharing plate systems, quickly transfer chip heat to the heat dissipation fins. At the same time, their flat structure can adapt to the thin design of laptops (thickness can be controlled within 1-3mm), meeting the lightweight requirements of devices without sacrificing heat dissipation efficiency.
2. Smartphones and mobile terminals
The 5G chip and high refresh rate screen of smartphones have high power consumption and are prone to overheating, resulting in performance degradation. Microchannel flat tubes can be used as the core components of vapor chambers or water-cooled cooling modules. Through the phase change (evaporation condensation) or forced convection of the internal coolant, the heat from heat sources such as processors and batteries can be quickly dissipated. Its compact size (customizable width of 5-10mm) can be flexibly embedded inside the body, avoiding excessive space occupation and adapting to the "lightweight" design of mobile phones.
2、 Data center and server cooling
1. Server chip heat dissipation
The long-term high load operation of CPU, GPU, and storage chips in data centers directly affects the stability and energy consumption of equipment due to their heat dissipation efficiency. Microchannel flat tubes can form an efficient water-cooled heat dissipation module, which is attached to the surface of the chip through a heat equalizing plate, and uses the rapid flow of internal coolant to remove heat (with more flow channels, faster flow rate, and a heat exchange efficiency more than 30% higher than traditional circular tubes). The flat structure of the flat tubes can be tightly arranged to adapt to the compact space layout of server cabinets, helping data centers achieve "high-density, low-energy" heat dissipation.
2. Cabinet level liquid cooling system
In immersed or cold plate liquid cooled servers, microchannel flat tubes can serve as key transmission components for the heat dissipation circuit, connecting the cold source and heating equipment. Its anti-corrosion and high pressure resistance characteristics (partially made of alloy materials) can adapt to the long-term circulation of cooling liquids (such as water and mineral oil). At the same time, the dense flow channel design can reduce flow resistance, reduce pump energy consumption, and improve the operating efficiency of the entire liquid cooling system.
3、 Industrial Control and Precision Electronic Equipment
1. Industrial Computers (IPC) and Embedded Systems
Industrial control equipment, such as CNC machine tools and control units for automated production lines, often operates in harsh environments such as dust and high temperatures, requiring high reliability in heat dissipation. The microchannel flat tube can be integrated into a closed heat dissipation shell, and the heat of the motherboard and power module can be exported through forced air cooling or liquid cooling. The corrosion resistance and structural strength of its metal material can adapt to long-term stable operation in industrial environments.
2. Medical electronic devices
The core control module and power system of CT machines and nuclear magnetic resonance equipment generate continuous heat during operation, and the internal space of the equipment is limited and sensitive to electromagnetic interference. The non-metallic material of microchannel flat tubes (such as aluminum tubes treated with insulation coatings) can avoid electromagnetic interference, while the compact structure and efficient heat dissipation ability can ensure the temperature stability of medical equipment during high-precision operation, reducing failures caused by overheating.
4、 New energy electronic devices and charging stations
1. In vehicle electronic system for electric vehicles
The electronic components such as the on-board charger (OBC), motor controller, and battery management system (BMS) of new energy vehicles generate a large amount of heat during charging, discharging, or high-speed driving, and the installation space is limited by the vehicle body. Microchannel flat tubes can serve as the core components of liquid cooling heat dissipation circuits, quickly transferring heat to the exterior radiator through close contact with heating components. Its lightweight characteristics (reducing weight by 20% -30% compared to traditional copper tubes) can also reduce vehicle energy consumption.
2. Fast charging station
The rectifier module and transformer of high-power fast charging piles (such as those above 120kW) generate a large amount of heat during operation, requiring efficient heat dissipation to ensure charging efficiency and safety. The air-cooled or water-cooled heat dissipation module composed of microchannel flat tubes can achieve rapid heat exchange in a narrow pile space, avoiding charging interruption or equipment damage caused by high temperature, and adapting to the development trend of charging piles with "high power and small volume".
5、 Communication equipment heat dissipation
1.5G base station and router
The RF module, power amplifier unit, and core router chips of 5G base stations consume much more power than 4G devices due to high-frequency communication requirements. The microchannel flat tube can be combined with heat dissipation fins to form an efficient heat dissipation module, which quickly dissipates heat to the outside through natural convection or forced air cooling. Its flat structure can adapt to the compact design of base station antenna covers and router housings, while its anti vibration and weather resistance (suitable for outdoor high and low temperature environments) ensure long-term stable operation of the equipment.
2. Data transmission equipment
High speed data transmission devices such as optical modules and switches generate local high temperatures due to the high-speed operation of internal chips. Microchannel flat tubes can achieve efficient "point-to-point" heat dissipation by adhering to the surface of the chip, avoiding data transmission delays or packet loss caused by high temperatures and ensuring the stability of communication links.
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